Bambu Lab AP Board Cover - H2D bondtech BMG extruder -Cable Base *1
$19.99
Description
-Cable Base *1
Brushless Motor
You get this bad boy
Snapmaker Luban 4-axis software support
Bambu Lab AP Board Cover - H2D bondtech BMG extruder -Cable Base *1Overview Covers and protects the AP board from dust and damage. Installation Learn more about AP Board Cover on Bambu Lab Wiki. In the Box AP Board Cover*1 Cable Tray Cover*1 BT2. 6 8 Screw*1 Compatibility H2D and H2D Laser Product Specifications Materials Plastic Packaging Size 122*122*262 mm Color Black Packaging Weight 0. 186 kg
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