G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current SEMI E125-1104 (technical revision)

SEMI E125-1104 (technical revision)

These values can be obtained from a measurement system capability analysis (refer to SEMI E89)

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The final goal of the Standard is to realize the traceability of semiconductor

G10000 - SEMI G100 - Specification for Gel Time of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G100-1122 - Current SEMI E125-1104 (technical revision)Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The characteristics